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LOW NOISE PHEMT MMIC * FEATURES 7 GHz to 11 GHz Frequency Band 1.4 dB Noise Figure 19 dB Gain 14 dBm Output Power at Saturation +3 V Single Bias Supply
LMA219B
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DESCRIPTION AND APPLICATIONS The Filtronic Solid State LMA219B is a low noise PHEMT amplifier which operates from 7 to 11GHz. This 2-stage reactive matched amplifier produces very low figure of 1.4dB with an associated gain of 19dB. The LMA219B is designed for phased array radar applications. DC decoupled input and output RF port. Ground is provided to the circuitry through vias to the backside metallization.
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ELECTRICAL SPECIFICATIONS @ TAmbient = 25C
(VDD = +3.0V, ZIN = ZOUT = 50) Parameter Frequency Band Small Signal Gain Drain Current at Saturation Small Signal Gain Flatness Noise Figure Power at 1-dB Compression Input Return Loss Output Return Loss Reverse Isolation Symbol F S21 IDSS S21 NF P-1dB S11 S22 S12 -30 IDS = 50% IDSS 9 VDD = 3V, RS = 10 RS = 0 Test Conditions Min 7 18 70 19 140 0.5 1.4 10 -12 -10 -40 3.0 dB dBm dB dB dB 210 Typ Max 11 Units GHz dB mA
Phone: (408) 988-1845 Fax: (408) 970-9950
http:// www.filss.com
Revised: 10/22/01 Email: sales@filss.com
LOW NOISE PHEMT MMIC * ABSOLUTE MAXIMUM RATINGS
Parameter Drain Voltage Operating Current RF Input Power Total Power Dissipation Channel Operating Temperature Storage Temperature Maximum Assembly Temperature (1 min. max.) Symbol VD IOP PIN PTOT TCH TSTG TMAX Test Conditions TAmbient = 22 3 C TAmbient = 22 3 C TAmbient = 22 3 C TAmbient = 22 3 C TAmbient = 22 3 C -- -- -65 Min Max 4 210 15 0.85 150 165 300 Units V mA dBm W C C C
LMA219B
Notes: * Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device. * Recommended Continuous Operating Limits should be observed for reliable device operation. * Power Dissipation defined as: PTOT (PDC + PIN) - POUT, where PDC: DC Bias Power PIN: RF Input Power POUT: RF Output Power * This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices.
Phone: (408) 988-1845 Fax: (408) 970-9950
http:// www.filss.com
Revised: 10/22/01 Email: sales@filss.com
LOW NOISE PHEMT MMIC * ASSEMBLY DRAWING
LMA219B
Notes: * Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended. Ultrasonic bonding is not recommended. * The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150C for 45 minutes. * Bond on bond or stitch bond acceptable. * Conductor over conductor acceptable. Conductors must not short.
Phone: (408) 988-1845 Fax: (408) 970-9950
http:// www.filss.com
Revised: 10/22/01 Email: sales@filss.com
LOW NOISE PHEMT MMIC * MECHANICAL OUTLINE
LMA219B
Notes: * * * *
All units are in microns (m). All bond pads are 100 X 100 m2 . Bias pad (VDD ) size is 100 X 121.5 m2 . Unless otherwise specified.
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HANDLING PRECAUTIONS To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 1A (0-500 V). Furthe r information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263.
All information and specifications are subject to change without notice.
Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 10/22/01 Email: sales@filss.com

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